Display device

ABSTRACT

A display device, which includes a display region in which a plurality of pixels are arranged, includes a first organic insulating film, a first groove, which exists in a frame shape surrounding the display region to separate the first organic insulating film, a first inorganic partition portion, which is arranged in the first groove, and is made of an inorganic insulating material that exists in a frame shape surrounding the display region, a second organic insulating film formed above the first organic insulating film and the first inorganic partition portion, and a second groove, which exists in a frame shape surrounding the display region to separate the second organic insulating film, and is located inside the first groove in plan view.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese application JP2016-001317 filed on Jan. 6, 2016, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a display device and a method ofmanufacturing the display device.

2. Description of the Related Art

In Japanese Patent Application Laid-open No. 2005-158292, it isdisclosed that a pixel electrode is arranged on a planarizationinsulating film containing an organic material, that an aperture portionis formed in an element isolation film, which covers the planarizationinsulating film and the pixel electrode, to expose the pixel electrode,and that the element isolation film may contain an organic material.

SUMMARY OF THE INVENTION

Meanwhile, in a display device including an organic insulating film, asdisclosed in Japanese Patent Application Laid-open No. 2004-335267,there are cases where a separation groove, which is configured to blockmoisture intrusion, is formed between a display region and an edge.

When such separation groove is to be applied to the display deviceincluding the two-layer organic insulating film as in Japanese PatentApplication Laid-open No. 2005-158292, there can be conceived a methodin which a first separation groove is formed in the lower organicinsulating film, then the upper organic insulating film is formed, and asecond separation groove is formed in a portion to fill the firstseparation groove. However, when the upper organic insulating film isformed by application, the portion to fill the first separation groovebecomes thicker than a portion above the lower organic insulating film.Therefore, under etching conditions optimized to form the aperture toexpose the pixel electrode, the portion to fill the first separationgroove cannot be fully separated by the second separation groove. As aresult, a remaining film of the upper organic insulating film serves asa moisture intrusion path, and there is a risk that a sufficientmoisture blocking property cannot be obtained. Moreover, under etchingconditions optimized so that no remaining film of the upper organicinsulating film is generated, the lower organic insulating film isexcessively etched, and there is a risk that a pattern defect may begenerated.

The present invention has been made in view of the above-mentionedproblems, and therefore has an object to provide a display device, whichis capable of preventing degradation of elements in a light emittinglayer due to moisture intrusion to a display portion by improving amoisture blocking property, and a method of manufacturing the displaydevice.

A display device, which includes a display region in which a pluralityof pixels are arranged, includes a first organic insulating film, afirst groove, which exists in a frame shape surrounding the displayregion to separate the first organic insulating film, a first inorganicpartition portion, which is arranged in the first groove, and is made ofan inorganic insulating material that exists in a frame shapesurrounding the display region, a second organic insulating film formedabove the first organic insulating film and the first inorganicpartition portion, and a second groove, which exists in a frame shapesurrounding the display region to separate the second organic insulatingfilm, and is located inside the first groove in plan view.

A method of manufacturing a display device, which includes a displayregion in which a plurality of pixels are arranged, the method includesforming a first inorganic partition portion, which is made of aninorganic insulating material that exists in a frame shape surroundingthe display region, forming a first organic insulating film having afirst groove, in which the first inorganic partition portion isarranged, forming a second organic insulating film above the firstorganic insulating film in a state in which the first inorganicpartition portion is arranged in the first groove, and forming a secondgroove, which exists in a frame shape surrounding the display region toseparate the second organic insulating film, and is located inside thefirst groove in plan view.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a display device according to a firstembodiment of the present invention.

FIG. 2 is a sectional view of the above-mentioned display device.

FIG. 3 is views for illustrating manufacturing steps of theabove-mentioned display device.

FIG. 4 is views for illustrating manufacturing steps of a display deviceaccording to a reference example.

FIG. 5 is a sectional view of a display device according to a secondembodiment of the present invention.

FIG. 6 is a sectional view of a display device according to a thirdembodiment of the present invention.

FIG. 7 is a sectional view of a display device according to a fourthembodiment of the present invention.

FIG. 8 is a sectional view of a display device according to a fifthembodiment of the present invention.

FIG. 9 is a sectional view of a display device according to a sixthembodiment of the present invention.

FIG. 10 is a sectional view of a display device according to a seventhembodiment of the present invention.

FIG. 11 is a sectional view of a display device according to a modifiedexample of the present invention.

FIG. 12 is a sectional view of a display device according to a modifiedexample of the present invention.

FIG. 13 is a sectional view of a display device according to a modifiedexample of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Now, embodiments of the present invention are described with referenceto the drawings. The disclosure in this specification is merely anexample of the present invention, and appropriate changes that can beeasily conceived by those skilled in the art without departing from themain gist of the invention are encompassed by the scope of theinvention. Moreover, widths, thicknesses, shapes, and the like of therespective parts illustrated in the figures may be schematicallyillustrated in some cases, and are not to limit the interpretation ofthe invention. Moreover, in the specification and the figures, elementslike those described above with reference to figures that have beenalready described are denoted by like reference symbols, and detaileddescription thereof may be omitted as appropriate.

As an example of a display device, an organic electro luminescence (EL)display device using organic light-emitting diodes (OLEDs), which are atype of self-light-emitting elements, is described below.

First Embodiment

FIG. 1 is a plan view of a display device 1 according to a firstembodiment of the present invention. FIG. 2 is a sectional view takenalong the line II-II of FIG. 1. The display device 1 includes a displaypanel 2, and a flexible printed circuit (FPC) 3 mounted to an endportion of the display panel 2. In a center portion of the display panel2, a rectangular display region 2A, in which a plurality of pixels arearranged in matrix, is provided. It is preferred that the plurality ofpixels are classified into a plurality of colors of emitted light, andexamples of the colors of emitted light of the pixels include threecolors: red, green, and blue, or four colors: red, green, blue, andwhite. Cyan, magenta, and yellow may be included as the colors ofemitted light of the pixels.

A frame region 2C having a frame shape is provided to surround thedisplay region 2A. In the frame region 2C, a plurality of moistureblocking structures 4 and 5 are provided to suppress moisture intrusionfrom an edge 2E of the display panel 2 to the display region 2A. Themoisture blocking structures 4 and 5 are located between the edge 2E ofthe display panel 2 and the display region 2A, and are formed into frameshapes to surround the display region 2A. In the example illustrated inthe figures, two moisture blocking structures 4 and 5 are arranged in adirection from the edge 2E to the display region 2A (this direction ishereinafter referred to as “direction of moisture intrusion”). However,the present invention is not limited thereto, and may include only onemoisture blocking structure. Moreover, in the example illustrated in thefigures, each of the moisture blocking structures 4 and 5 surrounds thedisplay region 2A without any interruption. However, the presentinvention is not limited thereto, and when another inorganic insulatingmaterial and other such structures exist inside the frame, the moistureblocking structure may be interrupted in the midway.

The display panel 2 includes an array substrate 6, and an opposingsubstrate 7, which is opposed to the array substrate 6. As illustratedin FIG. 12, the opposing substrate 7 may not be provided. The arraysubstrate 6 and the opposing substrate 7 are bonded to each other via afiller 8. Specifically, a frame-shaped sealing member 9 is providedalong the edge 2E of the display panel 2, and the filler 8 is filled ina space inside the sealing member 9. The display panel 2 is, forexample, of a top emission type in which light is emitted in a directionof the opposing substrate 7 (this direction is hereinafter referred toas “above”, and a direction opposite to the direction is hereinafterreferred to as “below”) with reference to the array substrate 6.

The opposing substrate 7 includes a substrate 61 made of glass, forexample. The substrate 61 may be made of a flexible resin, e.g.,polyimide, instead. When the display panel 2 is of the top emissiontype, the substrate 61 is transparent. On the side of the substrate 61that faces the array substrate 6, there are provided a black matrix (BM)63 in which apertures are formed to correspond to light emitting regionsof the respective pixels, a color filter 67 formed to partially overlapthe BM 63, and a planarization layer 65 covering the BM 63 and the colorfilter 67. The color filter 67 may be provided in the array substrate 6instead. The planarization layer 65 may not be provided.

The array substrate 6 includes a substrate 11 made of glass, forexample. The substrate 11 may be made of a flexible resin, e.g.,polyimide, instead. When the display panel 2 is of the top emissiontype, the substrate 11 does not need to be transparent. On a side of thesubstrate 11 that faces the opposing substrate 7, pixel circuits 30corresponding to the respective pixels and the like are provided in thedisplay region 2A, and the moisture blocking structures 4 and 5 and thelike are provided in the frame region 2C. The pixel circuits 30 includethin film transistors (TFTs), and are arranged to correspond to therespective pixels.

In the display region 2A, a semiconductor film 32 is provided above thesubstrate 11. The substrate 11 and the semiconductor film 32 are coveredby an interlayer insulating film 13, and gate electrodes 33 are arrangedabove the interlayer insulating film 13. The interlayer insulating film13 and the gate electrodes 33 are covered by an interlayer insulatingfilm 15, and source electrodes 34 and drain electrodes 36 are arrangedabove the interlayer insulating film 15. Interlayer connection holes forconnecting the source electrodes 34 and the drain electrodes 36 to thesemiconductor film 32 are formed in the interlayer insulating films 13and 15. Those semiconductor film 32, gate electrode 33, source electrode34, and drain electrode 36 form a TFT of the pixel circuit 30. The gateelectrode 33 is connected to a drain electrode of another TFT (notshown), and a power line (not shown) is connected to the sourceelectrode 34. The semiconductor film 32 includes, for example, an LTPSsemiconductor, an amorphous semiconductor, and an oxide semiconductor.The interlayer insulating films 13 and 15 are inorganic insulating filmseach made of an inorganic material, e.g., silicon oxide or siliconnitride. The gate electrode 33, the source electrode 34, and the drainelectrode 36 are each made of a metal, e.g., aluminum, silver, copper,nickel, or titanium.

In the example illustrated in the figure, the semiconductor film 32 isin contact with the substrate 11. However, the present invention is notlimited thereto, and one or a plurality of undercoat layers 12 asillustrated in FIG. 11 may be interposed between the substrate 11 andthe semiconductor film 32. The undercoat layers 12 are inorganicinsulating films each made of an inorganic material, e.g., silicon oxideor silicon nitride.

The interlayer insulating film 15, the source electrodes 34, and thedrain electrodes 36 are covered by an organic planarization film 17, andpixel electrodes 38 are arranged above the organic planarization film17. Interlayer connection holes are formed in the organic planarizationfilm 17 to connect the pixel electrodes 38 to the drain electrodes 36.The organic planarization film 17 is an example of a first organicinsulating film, and is an organic insulating film containing an organicmaterial, e.g., an acrylic resin. The organic planarization film 17 isformed to be thicker than the other interlayer insulating films, and hasa planar upper surface. The pixel electrodes 38 are anodes, for example,and are arranged to correspond to the respective pixels. The pixelelectrodes 38 are each made of a metal, e.g., indium tin oxide (ITO),aluminum, silver, copper, nickel, or titanium, and may include areflection surface.

The organic planarization film 17 and the pixel electrodes 38 arecovered by a pixel isolation film 19, and apertures 19 a are formed inthe pixel isolation film 19 to expose the pixel electrodes 38 excludingends thereof. Specifically, the pixel isolation film 19 covers the endsof the pixel electrodes 38, and the pixel electrodes 38 are exposed inthe other regions. Inner edge portions forming the apertures 19 a of thepixel isolation film 19 have a mildly tapered shape. The pixel isolationfilm 19 is an example of a second organic insulating film, and is anorganic insulating film containing an organic material, e.g., an acrylicresin. The pixel isolation film 19 is also called as banks or ribs.

The pixel isolation film 19 and the pixel electrodes 38 exposed in theapertures 19 a are covered by an organic film 21 containing a lightemitting layer. The organic film 21 includes, in order from the pixelelectrode 38 side, a hole injection layer, a hole transport layer, alight emitting layer, an electron transport layer, and an electroninjection layer, for example. The laminate structure of the organic film21 is not limited thereto, and is not particularly limited as long as atleast the light emitting layer is included. In this embodiment, a colorof emitted light of the light emitting layer included in the organicfilm 21 is white. However, the present invention is not limited thereto,and the color may be another color. The organic film 21 is formed byvapor deposition using no mask, for example, and is formed in a rangeincluding the display region 2A to the front of the moisture blockingstructure 4 on the inside.

The organic film 21 is covered by a counter electrode 23. The counterelectrode 23 is a cathode, for example, and is formed to cover theentire organic film 21. The counter electrode 23 is made of atransparent conductive material, e.g., indium tin oxide (ITO) or indiumzinc oxide (IZO). The counter electrode 23 is formed in a range thatcovers the organic film 21, for example, to between the moistureblocking structure 4 on the inside and the moisture blocking structure 5on the outside. Further, the counter electrode 23 is covered by asealing film 25. The sealing film 25 is an inorganic insulating filmmade of an inorganic material, e.g., silicon oxide or silicon nitride,and is formed over the entire array substrate 6. The sealing film 25 isin contact with the filler 8 and the sealing member 9.

In the frame region 2C, the moisture blocking structures 4 and 5, whichseparate each of the organic planarization film 17 and the pixelisolation film 19, are provided. First separation grooves 17 c, whichseparate the organic planarization film 17, are formed in the moistureblocking structures 4 and 5, and an inorganic partition portion 50 isarranged in the first separation groove 17 c. The first separationgrooves 17 c and the inorganic partition portion 50 separate the organicplanarization film 17. The inorganic partition portion 50 is made of aninorganic insulating material, e.g., silicon oxide or silicon nitride.The inorganic insulating material does not allow moisture to passtherethrough, and is not eroded as opposed to a metal. Therefore, theinorganic insulating material is optimal as a structure for blockingmoisture. The inorganic partition portion 50 has, for example, atrapezoid sectional shape, which has an upper surface and is increasedin width toward the bottom. To the contrary, the first separation groove17 c has an overhang shape in which a width on the upper side is smallerthan a width on the lower side. The upper surface of the inorganicpartition portion 50 is located above an upper surface of the organicplanarization film 17, and is at about the same height as upper surfacesof the pixel electrodes 38, for example.

Second separation grooves 19 c are also formed in the moisture blockingstructures 4 and 5 to separate the pixel isolation film 19. The secondseparation groove 19 c is formed to be contained inside the firstseparation groove 17 c in plan view. For example, a lower aperture ofthe second separation groove 19 c may be contained inside an upperaperture of the first separation groove 17 c in plan view. The secondseparation groove 19 c does not always need be formed to be containedinside the first separation groove 17 c as long as the second separationgroove 19 c overlaps the first separation groove 17 c in plan view. Thesecond separation groove 19 c has its bottom at the upper surface of theinorganic partition portion 50, and is formed so that a lower apertureof the second separation groove 19 c is contained in the upper surfaceof the inorganic partition portion 50, for example. An edge portion thatforms the second separation groove 19 c of the pixel isolation film 19is in contact with an upper corner portion of the inorganic partitionportion 50.

The counter electrode 23 and the sealing film 25 are further laminatedabove the inorganic partition portion 50 of the moisture blockingstructure 4 on the inside, and the sealing film 25 is further laminatedabove the inorganic partition portion 50 of the moisture blockingstructure 5 on the outside. A conductive film 39 in the same layer asthe pixel electrodes 38 is formed between the moisture blockingstructure 4 on the inside and the moisture blocking structure 5 on theoutside, and the counter electrode 23 is connected to the conductivefilm 39 via apertures formed in the pixel isolation film 19. In thisembodiment, an organic layer exists between the moisture blockingstructure 5 and the edge 2E, but a structure without the organic layermay be adopted as in FIG. 13.

As described above, the first separation grooves 17 c, the secondseparation grooves 19 c, and the inorganic partition portion 50 form themoisture blocking structures 4 and 5. With this structure, the organicplanarization film 17 and the pixel isolation film 19 are separated bythe moisture blocking structures 4 and 5, and no film containing anorganic material extends across the region of the moisture blockingstructures 4 and 5. In other words, none of the films that extend acrossthe region of the moisture blocking structures 4 and 5 contain anorganic material. Therefore, moisture intrusion from the edge 2E of thedisplay panel 2 to the display region 2A may be suppressed, and themoisture blocking property may be improved.

In the frame region 2C, circuit elements 40 containing TFTs, which aresimilar to the pixel circuits 30, are arranged below the inorganicpartition portion 50. The circuit element 40 is a gate drive circuit,for example. The circuit element 40 includes a conductive film 36 c inthe same layer as the source electrodes 34 and the drain electrodes 36of the pixel circuits 30. Moreover, wiring 47 that extends across theregion of the moisture blocking structures 4 and 5 is arranged betweenthe inorganic partition portion 50 and the interlayer insulating film15. The wiring 47 is connected to the circuit elements 40. The wiring 47is made of the conductive film 36 c in the same layer as the sourceelectrodes 34 and the drain electrodes 36 of the pixel circuits 30. Thedrain electrode 36 is an example of a lower electrode. The “same layer”as used herein refers to a layer formed at the same time and made of thesame material.

In this embodiment, the inorganic partition portion 50 is provided inthe moisture blocking structures 4 and 5, and the counter electrode 23is arranged above the inorganic partition portion 50. Therefore, theconductive film 36 c in the same layer as the source electrodes 34 andthe drain electrodes 36 of the pixel circuits 30 may be arranged in theregion of the moisture blocking structures 4 and 5 without any need toconsider a short circuit with the counter electrode 23. With thisstructure, the circuit elements 40 and the wiring 47 using theconductive film 36 may be provided in the region of the moistureblocking structures 4 and 5. Moreover, the circuit elements 40 may bearranged in the region of the moisture blocking structures 4 and 5, andhence a contribution may be made toward narrowing the frame.

[Manufacturing Method]

FIG. 3 is views for illustrating a part of manufacturing steps of thedisplay device 1. In the figure, the insulating film below theinterlayer insulating film 15 and a part of the conductive films areomitted.

In a step (a), the inorganic partition portion 50 is selectively formedabove the interlayer insulating film 15. The selective formation of theinorganic partition portion 50 is realized by, for example, forming acoating film made of an inorganic material to cover the interlayerinsulating film 15 by chemical vapor deposition (CVD), and patterningthe coating film by a photoetching technology. The inorganic partitionportion 50 is made of an inorganic material, e.g., silicon oxide orsilicon nitride. The inorganic partition portion 50 has a thickness ofabout 2.2 μm, for example.

In a step (b), a coating film 17 p, which is to form the organicplanarization film 17 later, is formed above the interlayer insulatingfilm 15. The formation of the coating film 17 p is realized by a coatingmethod, e.g., spin coating, and an upper surface of the coating film 17p is formed to be flat. Here, the coating film 17 p is formed by thecoating method under the state in which the inorganic partition portion50 is formed, and hence the coating film 17 p is formed to avoid theinorganic partition portion 50 so that an upper portion of the inorganicpartition portion 50 projects from the upper surface of the coating film17 p. As a result, the first separation grooves 17 c, which separate thecoating film 17 p in an in-plane direction, and are filled with theinorganic partition portion 50, are formed. In other words, an interfacebetween the coating film 17 p and the inorganic partition portion 50forms the first separation groove 17 c. The coating film 17 p containsan organic material, e.g., an acrylic resin. The coating film 17 p has athickness of about 2 μm, for example.

The present invention is not limited to the above-mentioned method. Forexample, the first separation grooves 17 c are formed in the coatingfilm 17 p, and then the inorganic partition portion 50 may be formedinside the first separation grooves 17 c.

In a step (c), the coating film 17 p is patterned by a photoetchingtechnology to complete the organic planarization film 17. The organicplanarization film 17 having a flat upper surface is formed to suppressthe short circuit of the pixel electrode 38 and the counter electrode 23due to a disconnection in the organic film including the light emittinglayer, and to prevent the disconnection of the organic film (see FIG.2).

In a step (d), the pixel electrodes 38 and the conductive film 39 areselectively formed above the organic planarization film 17. Theselective formation of the pixel electrodes 38 and the conductive film39 is realized by, for example, forming a metal film to cover theorganic planarization film 17 by sputtering or vapor deposition, andpatterning the metal film by a photoetching technology. The pixelelectrodes 38 and the conductive film 39 are made of metals, e.g.,indium tin oxide (ITO), aluminum, silver, copper, nickel, and titanium.The pixel electrodes 38 and the conductive film 39 have a thickness ofabout 0.2 μm, for example.

In a step (e), a coating film 19 p, which is to form the pixel isolationfilm 19 later, is formed above the organic planarization film 17, theinorganic partition portion 50, the pixel electrodes 38, and theconductive film 39. The formation of the coating film 19 p is realizedby a coating method, e.g., spin coating, and an upper surface of thecoating film 19 p is formed to be flat. The coating film 19 p containsan organic material, e.g., an acrylic resin. The coating film 19 p has athickness of about 1 μm, for example.

In a step (f), the apertures 19 a, which expose the pixel electrodes 38,and the second separation grooves 19 c, which separate the coating film19 p, are formed in the coating film 19 p at the same time to completethe pixel isolation film 19.

In this embodiment, the inorganic partition portion 50 is arranged inthe first separation grooves 17 c, and hence a portion of the coatingfilm 19 p that is formed above the inorganic partition portion 50becomes thinner than in a case where the inorganic partition portion 50is not arranged (see FIG. 4, which is to be described later). Therefore,even under etching conditions optimized to form the apertures 19 a inthe coating film 19 p, reliability of removing the portion of thecoating film 19 p that is formed above the inorganic partition portion50 may be improved, and the second separation grooves 19 c with, if any,a very small residue. As a result, the moisture blocking property isimproved.

It is preferred that the upper surface of the inorganic partitionportion 50 is located above the upper surface of the organicplanarization film 17 and below the upper surface of the pixel isolationfilm 19, and it is particularly preferred that the upper surface of theinorganic partition portion 50 is located at about the same height asthe upper surface of the pixel electrodes 38. In this case, the portionof the coating film 19 p that is formed above the inorganic partitionportion 50 has about the same thickness as portions of the coating film19 p that are formed above the pixel electrodes 38. Therefore, theetching conditions optimized to form the apertures 19 a in the coatingfilm 19 p are also optimized to form the second separation grooves 19 c,and the reliability of removal is further improved.

REFERENCE EXAMPLE

FIG. 4 is views for illustrating manufacturing steps of a display deviceaccording to a reference example in which the above-mentioned inorganicpartition portion 50 is not provided. In a step (x), first separationgrooves 97 c are formed in an organic planarization film 97, and pixelelectrodes 98 are selectively formed above the organic planarizationfilm 97. At the bottom of the first separation grooves 97 c, aninterlayer insulating film 95 is exposed.

In a step (y), a coating film 99 p, which is to form a pixel isolationfilm 99 later, is formed above the organic planarization film 97 and theinterlayer insulating film 95, which is exposed at the bottom of thefirst separation grooves 97 c, by a coating method, e.g., spin coating.At this time, inside the first separation grooves 97 c, a fillingportion 99 y, in which a material of the coating film 99 p is filled ina large amount, is formed. The filling portion 99 y becomes thicker thanthe portion of the coating film 99 p that is formed above the pixelelectrodes 98.

In a step (z), the coating film 99 p is patterned by a photoetchingtechnology to form apertures 99 a, which expose the pixel electrodes 98,and second separation grooves 99 c, which separate the coating film 99p. However, with the thick filling portion 99 y existing inside thefirst separation grooves 97 c, under etching conditions optimized toform the apertures 99 a in the coating film 99 p, there is a risk thatthe filling portion 99 y cannot be removed completely to form a residue99 z, resulting in an insufficient moisture blocking property.

Second Embodiment

FIG. 5 is a sectional view of a display device according to a secondembodiment of the present invention. In the moisture blocking structures4 and 5 in the second embodiment, the upper surface of the inorganicpartition portion 50 is located below the upper surface of the organicplanarization film 17, and the second separation grooves 19 c arelocated inside the first separation grooves 17 c. The first separationgrooves 17 c are formed by, for example, first forming the inorganicpartition portion 50, forming in this state a coating film, which coversthe inorganic partition portion 50 and is to form the organicplanarization film 17, and etching to remove a portion of the coatingfilm that is formed above the inorganic partition portion 50. Therefore,the first separation groove 17 c includes a lower portion in which theinorganic partition portion 50 is provided, and an upper portion formedby etching. The second separation groove 19 c has its bottom at theupper surface of the inorganic partition portion 50, and an edge portionof the pixel isolation film 19 that forms the second separation groove19 c covers an inclined surface of the first separation groove 17 c, andis in contact with the upper surface of the inorganic partition portion50. The organic planarization film 17 has a thickness of about 2 μm, forexample, and the inorganic partition portion 50 has a thickness of about1.5 μm, for example.

Even with the upper surface of the inorganic partition portion 50 beinglocated below the upper surface of the organic planarization film 17 asdescribed above, when the pixel isolation film 19 is formed, the portionof the coating film, which is to form the pixel isolation film 19, thatis formed above the inorganic partition portion 50 becomes thinner thanwhen the inorganic partition portion 50 is not provided, and hence thereliability of removing the portion is improved, to thereby improve themoisture blocking property. Moreover, the time required to form theinorganic partition portion 50, for example, the time required todeposit the coating film, which is to form the inorganic partitionportion 50, may be reduced than in the first embodiment. Therefore, boththe moisture blocking property and productivity is achieved.

Third Embodiment

FIG. 6 is a sectional view of a display device according to a thirdembodiment of the present invention. In the moisture blocking structures4 and 5 in the third embodiment, an organic base 52 is provided insidethe inorganic partition portion 50. Specifically, the organic base 52 isprovided above the interlayer insulating film 15, and the inorganicpartition portion 50 is formed to cover the organic base 52. An uppersurface and side surfaces of the organic base 52 are covered by theinorganic partition portion 50, and a lower surface of the organic base52 is covered by the interlayer insulating film 15 and a conductivelayer 36 c. With such inorganic partition portion 50 in which theorganic base 52 is provided inside, the moisture blocking structures 4and 5 may be realized. Moreover, an organic material is easier toquickly form a thick coating film as compared to an inorganic material.Therefore, a reduction in time required for the formation is achieved byproviding the organic base 52 in advance and forming the inorganicpartition portion 50 to cover the organic base 52.

Fourth Embodiment

FIG. 7 is a sectional view of a display device according to a fourthembodiment of the present invention. In the moisture blocking structures4 and 5 in the fourth embodiment, the conductive film 38 c in the samelayer as the pixel electrodes 38 is provided above the inorganicpartition portion 50. The upper surface of the inorganic partitionportion 50 is located below the upper surface of the organicplanarization film 17, and the conductive film 38 c is located insidethe first separation grooves 17 c. The upper surface of the conductivefilm 38 c is located below the upper surface of the organicplanarization film 17. However, the present invention is not limitedthereto, and the upper surface of the conductive film 38 c may belocated above the upper surface of the organic planarization film 17.The second separation groove 19 c has its bottom at the upper surface ofthe conductive film 38 c, and an edge portion that forms the secondseparation groove 19 c of the pixel isolation film 19 covers an inclinedsurface of the first separation groove 17 c, and is in contact with theupper surface of the conductive film 38 c. The conductive film 38 c iselectrically isolated from the pixel electrode 38.

With the conductive film 38 c being provided above the inorganicpartition portion 50 as described above, a total thickness of theinorganic partition portion 50 and the conductive film 38 c is enough toimprove the moisture blocking property. In other words, in forming thepixel isolation film 19, a thickness of a portion of the coating film,which is to form the pixel isolation film 19, that is formed above theconductive film 38 c becomes thinner than in the second embodiment.Therefore, the reliability of removing the portion may be furtherimproved, and as a result, the moisture blocking property is improved.

Fifth Embodiment

FIG. 8 is a sectional view of a display device according to a fifthembodiment of the present invention. In the moisture blocking structures4 and 5 in the fifth embodiment, the inorganic partition portion 50 isformed utilizing the interlayer insulating film 15. In the exampleillustrated in the figure, an inorganic base 51 is provided above thesubstrate 11, and the interlayer insulating films 13 and 15 arelaminated above the inorganic base 51 to form the inorganic partitionportion 50 having the upper surface and the side surfaces that are madeof the interlayer insulating film 15. The inorganic base 51 is made ofan inorganic material, e.g., silicon oxide or silicon nitride. With suchinorganic partition portion 50 formed utilizing the interlayerinsulating film 15, the moisture blocking property is improved.

Incidentally, in the fifth embodiment, the upper surface of theinterlayer insulating film 15 forming the inorganic partition portion 50forms the bottom of the second separation grooves 19 c. In this case,when the wiring 47 (see FIG. 2 etc.) in the same layer as the sourceelectrodes 34 and the drain electrodes 36 of the pixel circuits 30 isformed on an upper surface of the interlayer insulating film 15 formingthe inorganic partition portion 50, a short circuit with the counterelectrode 23 becomes a problem. Therefore, in the fifth embodiment, inthe region of the moisture blocking structures 4 and 5, wiring 48 in thesame layer as the gate electrodes 33 of the pixel circuits 30 isutilized. Specifically, in regions other than the moisture blockingstructures 4 and 5 of the frame region 2C, wiring 49 in the same layeras the source electrodes 34 and the drain electrodes 36 of the pixelcircuits 30 is provided, and in the region of the moisture blockingstructures 4 and 5, the wiring 48 in the same layer as the gateelectrodes 33 of the pixel circuits 30, which is connected to the wiring49 via interlayer connection holes formed in the interlayer insulatingfilm 15, is provided between the interlayer insulating films 13 and 15.

Sixth Embodiment

FIG. 9 is a sectional view of a display device according to a sixthembodiment of the present invention. In the sixth embodiment, theinterlayer insulating film 18 is provided between the organicplanarization film 17 and the pixel isolation film 19, and capacitanceforming electrodes 37, which are opposed to the pixel electrodes 38 withthe interlayer insulating film 18 being interposed between thecapacitance forming electrodes 37 and the pixel electrodes 38, arearranged between the organic planarization film 17 and the interlayerinsulating film 18. The interlayer insulating film 18 is an inorganicinsulating film made of an inorganic material, e.g., silicon oxide orsilicon nitride. The capacitance forming electrodes 37 are each made ofa metal, e.g., aluminum, silver, copper, nickel, or titanium.

The interlayer insulating film 18 and the capacitance forming electrodes37 extend also to the frame region 2C. The interlayer insulating film 18extends over the entire frame region 2C, and the capacitance formingelectrodes 37 extend past the moisture blocking structure 4 on theinside and to between the moisture blocking structure 4 on the insideand the moisture blocking structure 5 on the outside, for example. As aresult, the interlayer insulating film 18 and the capacitance formingelectrode 37 are provided above the inorganic partition portion 50 inthe moisture blocking structure 4 on the inside, and the interlayerinsulating film 18 is provided above the inorganic partition portion 50in the moisture blocking structure 5 on the outside. The secondseparation groove 19 c has its bottom at a portion of the interlayerinsulating film 18 that is formed above the inorganic partition portion50, for example. Moreover, the capacitance forming electrode 37 isconnected to the counter electrode 23 via the conductive film 39 betweenthe moisture blocking structure 4 on the inside and the moistureblocking structure 5 on the outside so that the capacitance formingelectrode 37 and the counter electrode 23 have the same potential.

Even when at least one of the interlayer insulating film 18 and thecapacitance forming electrode 37 is provided above the inorganicpartition portion 50 as described above, the moisture blocking propertyis improved. Further, with the interlayer insulating film 18 and thecapacitance forming electrode 37 being provided above the inorganicpartition portion 50 as described above, a total thickness of theinorganic partition portion 50, the interlayer insulating film 18, andthe capacitance forming electrode 37 is enough to improve the moistureblocking property. In other words, in forming the pixel isolation film19, a thickness of a portion of the coating film, which is to form thepixel isolation film 19, that is formed above the interlayer insulatingfilm 18 becomes thinner than in the second embodiment. Therefore, thereliability of removing the portion is further improved, and as aresult, the moisture blocking property is improved.

Seventh Embodiment

FIG. 10 is a sectional view of a display device according to a seventhembodiment of the present invention. In the moisture blocking structures4 and 5 in the seventh embodiment, the inorganic partition portion 50includes the inorganic base 51 and the conductive film 36 c, and thecapacitance forming electrode 37, the interlayer insulating film 18, andthe conductive film 38 c are arranged above the inorganic partitionportion 50. The second separation groove 19 c has its bottom at theupper surface of the conductive film 38 c. The inorganic base 51, theconductive film 36 c, the capacitance forming electrode 37, theinterlayer insulating film 18, and the conductive film 38 c are utilizedas described above to secure a total thickness thereof, and to improvethe moisture blocking property. In other words, in forming the pixelisolation film 19, a thickness of a portion, which is formed above theconductive film 38 c, of the coating film, which is to form the pixelisolation film 19, becomes thinner than in the second embodiment.Therefore, the reliability of removing the portion is further improved,and as a result, the moisture blocking property may be improved.

MODIFIED EXAMPLE

The above-mentioned sixth embodiment (see FIG. 9) may be applied to adisplay device having the sectional structure illustrated in FIG. 11. Inthis modified example, the TFTs of the pixel circuits 30 arranged in thedisplay region 2A are N-channel (Nch) TFTs, for example, and the circuitelements 40, e.g., the gate drive circuits, arranged in the frame region2C are P-channel (Pch) TFTs, for example. In the Nch TFT, a low-densityimpurity region is provided between a channel region opposed to the gateelectrode 33 of the semiconductor film 32, and a connection region inwhich the source electrode 34 and the drain electrode 36 are connectedto each other. Also in the Pch TFT, a low-density impurity region isprovided between a channel region opposed to the gate electrode 43 ofthe semiconductor film 42 and the connection region in which the sourceelectrode 44 and the drain electrode 46 are connected to each other.

An extending portion of the gate electrode 33 of the pixel circuit 30forms a storage capacitor line, and forms a storage capacitor with thesemiconductor film 32. Moreover, the extending portion of the gateelectrode 33 also forms a storage capacitor with an extending portion ofthe drain electrode 36. The conductive layer including the gateelectrodes 33 and 43 has the laminate structure in which aluminum andtitanium are laminated, for example. The conductive layer including thesource electrodes 34 and 44 and the drain electrodes 36 and 46 has thelaminate structure in which titanium, aluminum, and titanium arelaminated in the stated order, for example. The wiring formed of theconductive layer including the source electrodes 34 and 44 and the drainelectrodes 36 and 46 is routed to a terminal portion provided in an endportion of the array substrate 6 to form a terminal 70.

In portions of the conductive layer including the source electrodes 34and 44 and the drain electrodes 36 and 46 that are exposed by removingthe organic planarization film 17 and other such portions, conductivefilms 381, 382, and 383 are formed made of a transparent conductivematerial, e.g., ITO. Specifically, the conductive film 381 is formed inan interlayer connection hole formed in the organic planarization film17 to expose the drain electrode 36 in the display region 2A. Further,an interlayer connection hole is also formed in the interlayerinsulating film 18, which fills the interlayer connection hole in theorganic planarization film 17, and allows the pixel electrode 38 to beconnected to the conductive film 381. The conductive film 382 is formedon the upper surface of the organic planarization film 17 in the frameregion 2C to connect the capacitance forming electrode 37 and thecounter electrode 23 to each other. In other words, the conductive film382 is connected to the capacitance forming electrode 37, which is alsoarranged between the organic planarization film 17 and the pixelisolation film 19, and is also connected to the counter electrode 23 viathe interlayer connection hole formed in the pixel isolation film 19.The terminal 70 in the terminal portion is covered by the conductivefilm 383.

The capacitance forming electrode 37 has the laminate structure in whichmolybdenum, aluminum, and molybdenum are laminated in the stated order,for example. The pixel electrode 38 has the laminate structure in whichITO, silver, and ITO are laminated in the stated order, for example.

While there have been described what are at present considered to becertain embodiments of the invention, it will be understood that variousmodifications may be made thereto, and it is intended that the appendedclaims cover all such modifications as fall within the true spirit andscope of the invention.

1-15. (canceled)
 16. A display device, which includes a display regionin which pixels are arranged, comprising: a first organic insulatingfilm; a first groove; a first inorganic partition portion; a secondorganic insulation film; a second groove, wherein the first grooveseparates the first organic insulation film and has a frame shapesurrounding the display region, the first inorganic partition portion isin the first groove and has a frame shape surrounding the displayregion, the second groove separates the second organic insulation film,and the first groove and the second groove are overlapped in plan view.17. The display device according to claim 16, wherein the firstinorganic partition portion includes an upper surface that is above anupper surface of the first organic insulating film.
 18. The displaydevice according to claim 16, wherein the first inorganic partitionportion includes an upper surface that is below an upper surface of thesecond organic insulating film.
 19. The display device according toclaim 16, wherein the first inorganic partition portion includes anupper surface that is below an upper surface of the first organicinsulating film, and wherein the second groove is inside the firstgroove.
 20. The display device according to claim 16, wherein the firstinorganic partition portion has a frame shape.
 21. The display deviceaccording to claim 16, further comprising: a third groove which has aframe shape surrounding the first groove to separate the first organicinsulating film; a second inorganic partition portion, which is in thethird groove and has a frame shape surrounding the first groove.
 22. Thedisplay device according to claim 16, wherein the second groove has aframe shape surrounding the display region.
 23. The display deviceaccording to claim 22, further comprising: a third groove which has aframe shape surrounding the first groove to separate the first organicinsulating film; a second inorganic partition portion which is in thethird groove and has a frame shape surrounding the first groove.
 24. Thedisplay device according to claim 23, further comprising: a fourthgroove, wherein the fourth groove has a frame shape surrounding thesecond groove, the fourth groove is separated from the second organicinsulating film, and the fourth groove is located inside the thirdgroove in plan view.
 25. The display device according to claim 16,further comprising: a pixel electrode which is above the first organicinsulating film; an inorganic insulating film which is below the firstorganic insulating film; and a lower electrode which is between thefirst organic insulating film and the inorganic insulating film to beconnected to the pixel electrode via an interlayer connection holeformed in the first organic insulating film, wherein, between the firstinorganic partition portion and the inorganic insulating film, wiringsin a same layer as the lower electrode extend across a region of thefirst inorganic partition portion.
 26. The display device according toclaim 16, further comprising: an inorganic insulating film below thefirst organic insulating film; and a lower electrode arranged betweenthe first organic insulating film and the inorganic insulating film tobe connected to a pixel electrode via an interlayer connection hole inthe first organic insulating film, wherein a circuit element including aconductive film in a same layer as the lower electrode is below thefirst inorganic partition portion.
 27. The display device according toclaim 16, further comprising: an inorganic insulating film between thefirst organic insulating film and the second organic insulating film;and a counter electrode between the first organic insulating film andthe inorganic insulating film to be opposed to a pixel electrode withthe inorganic insulating film being interposed between the counterelectrode and the pixel electrode, wherein at least one of a part of theinorganic insulating film or a conductive film in a same layer as thecounter electrode is above the first inorganic partition portion. 28.The display device according to claim 16, wherein a conductive film in asame layer as a pixel electrode is above the first inorganic partitionportion.
 29. The display device according to claim 16, furthercomprising: an inorganic insulating film below the first organicinsulating film; and a lower electrode between the first organicinsulating film and the inorganic insulating film to be connected to apixel electrode via an interlayer connection hole formed in the firstorganic insulating film, wherein the first inorganic partition portionincludes at least one of a part of the inorganic insulating film or aconductive film in a same layer as the lower electrode.
 30. The displaydevice according to claim 16, further comprising: an organic film whichis arranged on a pixel electrode in an aperture formed in the secondorganic insulating film and includes a light emitting layer; and acounter electrode is on the organic film.
 31. The display deviceaccording to claim 16, wherein an organic material is not to extendacross a region of the first inorganic partition portion.